X-Ray Inspection

X-ray scanning reveals hidden internal defects such as voids, cracked solder joints, or inconsistencies in BGA packaging. This non-destructive method allows internal verification without damaging the part.

Key Measures:

• 2D and 3D X-ray imaging

• Solder and internal structure analysis

• Detection of hidden damage or tampering

Tools Used:
X-ray inspection systems • BGA analysis software